燙金基(ji)本工藝(yi)是在壓力狀態，即(ji)電(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)被燙印版、承印物壓住的狀態下，電(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)受(shou)熱(re)使其上(shang)(shang)熱(re)熔(rong)性的有機硅(gui)樹脂(zhi)層(ceng)和膠(jiao)牯(gu)劑(ji)(ji)熔(rong)化(hua)(hua)，此時受(shou)熱(re)熔(rong)化(hua)(hua)的有機硅(gui)樹脂(zhi)粘(zhan)(zhan)性變小(xiao)，而特種(zhong)熱(re)敏(min)膠(jiao)粘(zhan)(zhan)劑(ji)(ji)受(shou)熱(re)熔(rong)化(hua)(hua)后粘(zhan)(zhan)性增加(jia)，使得鋁(lv)(lv)(lv)層(ceng)與電(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)基(ji)膜(mo)剝離(li)的同時轉印到了承印物上(shang)(shang)。隨著壓力的卸除，膠(jiao)粘(zhan)(zhan)劑(ji)(ji)迅(xun)速冷卻固化(hua)(hua)，鋁(lv)(lv)(lv)層(ceng)牢固地附著在承印物上(shang)(shang)，完成一個燙印過程。