燙(tang)金基(ji)本工藝是在(zai)壓力狀態，即電(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)版(ban)、承(cheng)(cheng)印(yin)物(wu)壓住的狀態下，電(dian)化(hua)(hua)鋁(lv)受熱使其上熱熔(rong)性(xing)的有(you)(you)機(ji)硅(gui)樹脂(zhi)層和膠牯劑熔(rong)化(hua)(hua)，此(ci)時受熱熔(rong)化(hua)(hua)的有(you)(you)機(ji)硅(gui)樹脂(zhi)粘(zhan)性(xing)變(bian)小，而特種熱敏膠粘(zhan)劑受熱熔(rong)化(hua)(hua)后(hou)粘(zhan)性(xing)增加，使得鋁(lv)層與電(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離的同時轉印(yin)到(dao)了(le)承(cheng)(cheng)印(yin)物(wu)上。隨著壓力的卸除，膠粘(zhan)劑迅(xun)速冷卻(que)固化(hua)(hua)，鋁(lv)層牢固地附著在(zai)承(cheng)(cheng)印(yin)物(wu)上，完(wan)成(cheng)一個燙(tang)印(yin)過(guo)程(cheng)。