燙金基本工藝是(shi)在(zai)壓力(li)狀(zhuang)(zhuang)態(tai)，即電(dian)(dian)化(hua)鋁(lv)(lv)被燙印版、承印物(wu)(wu)(wu)壓住的(de)(de)狀(zhuang)(zhuang)態(tai)下(xia)，電(dian)(dian)化(hua)鋁(lv)(lv)受熱(re)使(shi)(shi)其上熱(re)熔(rong)性(xing)的(de)(de)有機硅樹脂(zhi)層(ceng)(ceng)和膠(jiao)牯劑熔(rong)化(hua)，此時受熱(re)熔(rong)化(hua)的(de)(de)有機硅樹脂(zhi)粘(zhan)(zhan)性(xing)變小，而(er)特種熱(re)敏膠(jiao)粘(zhan)(zhan)劑受熱(re)熔(rong)化(hua)后粘(zhan)(zhan)性(xing)增加(jia)，使(shi)(shi)得鋁(lv)(lv)層(ceng)(ceng)與電(dian)(dian)化(hua)鋁(lv)(lv)基膜剝離的(de)(de)同時轉印到了承印物(wu)(wu)(wu)上。隨(sui)著壓力(li)的(de)(de)卸除，膠(jiao)粘(zhan)(zhan)劑迅速冷卻(que)固化(hua)，鋁(lv)(lv)層(ceng)(ceng)牢(lao)固地附著在(zai)承印物(wu)(wu)(wu)上，完成(cheng)一個燙印過程(cheng)。