燙(tang)金基(ji)本工藝(yi)是在壓力狀態，即電(dian)(dian)化(hua)鋁(lv)(lv)(lv)被燙(tang)印版(ban)、承(cheng)印物(wu)(wu)(wu)壓住的狀態下，電(dian)(dian)化(hua)鋁(lv)(lv)(lv)受(shou)熱(re)(re)(re)使其上熱(re)(re)(re)熔性的有(you)機硅樹脂(zhi)層和膠牯劑(ji)(ji)熔化(hua)，此時受(shou)熱(re)(re)(re)熔化(hua)的有(you)機硅樹脂(zhi)粘性變小(xiao)，而特(te)種(zhong)熱(re)(re)(re)敏膠粘劑(ji)(ji)受(shou)熱(re)(re)(re)熔化(hua)后粘性增加，使得鋁(lv)(lv)(lv)層與電(dian)(dian)化(hua)鋁(lv)(lv)(lv)基(ji)膜剝離的同時轉印到了承(cheng)印物(wu)(wu)(wu)上。隨著(zhu)壓力的卸除，膠粘劑(ji)(ji)迅速冷卻固(gu)化(hua)，鋁(lv)(lv)(lv)層牢固(gu)地附(fu)著(zhu)在承(cheng)印物(wu)(wu)(wu)上，完(wan)成一個(ge)燙(tang)印過程。