燙(tang)金基本工藝是在壓力(li)狀態，即電(dian)(dian)化(hua)(hua)(hua)鋁(lv)被(bei)燙(tang)印(yin)(yin)版、承(cheng)印(yin)(yin)物壓住的(de)狀態下，電(dian)(dian)化(hua)(hua)(hua)鋁(lv)受(shou)熱使其上熱熔(rong)(rong)性(xing)的(de)有機硅(gui)樹脂層和(he)膠(jiao)牯劑熔(rong)(rong)化(hua)(hua)(hua)，此時受(shou)熱熔(rong)(rong)化(hua)(hua)(hua)的(de)有機硅(gui)樹脂粘(zhan)性(xing)變小(xiao)，而特種(zhong)熱敏膠(jiao)粘(zhan)劑受(shou)熱熔(rong)(rong)化(hua)(hua)(hua)后(hou)粘(zhan)性(xing)增(zeng)加，使得(de)鋁(lv)層與電(dian)(dian)化(hua)(hua)(hua)鋁(lv)基膜剝(bo)離的(de)同時轉印(yin)(yin)到了(le)承(cheng)印(yin)(yin)物上。隨著(zhu)壓力(li)的(de)卸(xie)除(chu)，膠(jiao)粘(zhan)劑迅速冷卻固化(hua)(hua)(hua)，鋁(lv)層牢(lao)固地(di)附著(zhu)在承(cheng)印(yin)(yin)物上，完成一個燙(tang)印(yin)(yin)過(guo)程。