燙(tang)金基(ji)本(ben)工藝是在(zai)壓(ya)力(li)狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)(yin)版、承印(yin)(yin)物壓(ya)住(zhu)的狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)受熱(re)使其(qi)上(shang)熱(re)熔(rong)性(xing)的有機硅(gui)樹脂層和(he)膠牯劑熔(rong)化(hua)(hua)(hua)，此時受熱(re)熔(rong)化(hua)(hua)(hua)的有機硅(gui)樹脂粘(zhan)(zhan)性(xing)變(bian)小，而特種熱(re)敏膠粘(zhan)(zhan)劑受熱(re)熔(rong)化(hua)(hua)(hua)后粘(zhan)(zhan)性(xing)增加，使得鋁(lv)(lv)層與電(dian)化(hua)(hua)(hua)鋁(lv)(lv)基(ji)膜剝離的同時轉(zhuan)印(yin)(yin)到了承印(yin)(yin)物上(shang)。隨著壓(ya)力(li)的卸除(chu)，膠粘(zhan)(zhan)劑迅(xun)速冷卻固化(hua)(hua)(hua)，鋁(lv)(lv)層牢固地附著在(zai)承印(yin)(yin)物上(shang)，完(wan)成一個燙(tang)印(yin)(yin)過(guo)程(cheng)。