燙(tang)(tang)金基(ji)本工藝是在壓力狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)被燙(tang)(tang)印(yin)版、承(cheng)印(yin)物壓住的(de)狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)受(shou)熱使其上(shang)熱熔(rong)性(xing)的(de)有機(ji)硅樹(shu)脂層(ceng)和膠(jiao)(jiao)(jiao)牯(gu)劑(ji)熔(rong)化(hua)(hua)(hua)，此時(shi)受(shou)熱熔(rong)化(hua)(hua)(hua)的(de)有機(ji)硅樹(shu)脂粘(zhan)性(xing)變小，而特(te)種(zhong)熱敏膠(jiao)(jiao)(jiao)粘(zhan)劑(ji)受(shou)熱熔(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)增加(jia)，使得鋁(lv)層(ceng)與(yu)電(dian)化(hua)(hua)(hua)鋁(lv)基(ji)膜剝離的(de)同時(shi)轉印(yin)到(dao)了承(cheng)印(yin)物上(shang)。隨著壓力的(de)卸除(chu)，膠(jiao)(jiao)(jiao)粘(zhan)劑(ji)迅速冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)層(ceng)牢固(gu)地附著在承(cheng)印(yin)物上(shang)，完成一(yi)個(ge)燙(tang)(tang)印(yin)過程。