燙(tang)金基(ji)本工(gong)藝是在壓力狀態(tai)(tai)，即電化(hua)(hua)鋁(lv)被燙(tang)印版、承(cheng)印物壓住(zhu)的(de)(de)狀態(tai)(tai)下(xia)，電化(hua)(hua)鋁(lv)受(shou)(shou)熱(re)使其上(shang)熱(re)熔(rong)(rong)(rong)(rong)性(xing)(xing)的(de)(de)有機硅樹脂層和膠(jiao)牯劑(ji)(ji)熔(rong)(rong)(rong)(rong)化(hua)(hua)，此(ci)時受(shou)(shou)熱(re)熔(rong)(rong)(rong)(rong)化(hua)(hua)的(de)(de)有機硅樹脂粘(zhan)(zhan)性(xing)(xing)變小，而特種熱(re)敏膠(jiao)粘(zhan)(zhan)劑(ji)(ji)受(shou)(shou)熱(re)熔(rong)(rong)(rong)(rong)化(hua)(hua)后(hou)粘(zhan)(zhan)性(xing)(xing)增(zeng)加，使得鋁(lv)層與電化(hua)(hua)鋁(lv)基(ji)膜(mo)剝離(li)的(de)(de)同時轉印到了承(cheng)印物上(shang)。隨著(zhu)壓力的(de)(de)卸除(chu)，膠(jiao)粘(zhan)(zhan)劑(ji)(ji)迅速(su)冷卻(que)固化(hua)(hua)，鋁(lv)層牢固地附著(zhu)在承(cheng)印物上(shang)，完成(cheng)一(yi)個燙(tang)印過程。