燙(tang)金基本工藝是在壓力(li)狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)被燙(tang)印(yin)版、承(cheng)印(yin)物壓住的(de)狀態下(xia)，電(dian)化(hua)(hua)(hua)鋁(lv)受熱使(shi)其(qi)上(shang)熱熔(rong)性(xing)的(de)有(you)(you)機(ji)硅樹(shu)脂層(ceng)和膠牯(gu)劑熔(rong)化(hua)(hua)(hua)，此時受熱熔(rong)化(hua)(hua)(hua)的(de)有(you)(you)機(ji)硅樹(shu)脂粘(zhan)性(xing)變小，而特(te)種熱敏膠粘(zhan)劑受熱熔(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)增(zeng)加，使(shi)得鋁(lv)層(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)基膜剝離的(de)同時轉印(yin)到了(le)承(cheng)印(yin)物上(shang)。隨著(zhu)(zhu)壓力(li)的(de)卸除，膠粘(zhan)劑迅速冷卻固化(hua)(hua)(hua)，鋁(lv)層(ceng)牢固地附著(zhu)(zhu)在承(cheng)印(yin)物上(shang)，完(wan)成(cheng)一(yi)個燙(tang)印(yin)過程。