燙(tang)金(jin)基本(ben)工藝是在壓力(li)狀態，即電(dian)化(hua)鋁(lv)(lv)(lv)(lv)被燙(tang)印(yin)版、承(cheng)(cheng)印(yin)物壓住的狀態下，電(dian)化(hua)鋁(lv)(lv)(lv)(lv)受熱(re)使其(qi)上(shang)熱(re)熔(rong)性的有(you)機硅(gui)樹(shu)脂(zhi)層(ceng)和(he)膠牯(gu)劑熔(rong)化(hua)，此時受熱(re)熔(rong)化(hua)的有(you)機硅(gui)樹(shu)脂(zhi)粘(zhan)(zhan)性變小，而(er)特種熱(re)敏膠粘(zhan)(zhan)劑受熱(re)熔(rong)化(hua)后粘(zhan)(zhan)性增加，使得鋁(lv)(lv)(lv)(lv)層(ceng)與電(dian)化(hua)鋁(lv)(lv)(lv)(lv)基膜剝離的同時轉印(yin)到了承(cheng)(cheng)印(yin)物上(shang)。隨著壓力(li)的卸除，膠粘(zhan)(zhan)劑迅速冷卻固(gu)化(hua)，鋁(lv)(lv)(lv)(lv)層(ceng)牢固(gu)地附(fu)著在承(cheng)(cheng)印(yin)物上(shang)，完成(cheng)一個燙(tang)印(yin)過程。