燙(tang)金(jin)基本(ben)工藝是在壓力狀態，即電化(hua)(hua)(hua)鋁(lv)被燙(tang)印(yin)版、承(cheng)印(yin)物(wu)壓住的狀態下(xia)，電化(hua)(hua)(hua)鋁(lv)受(shou)熱(re)使其(qi)上(shang)(shang)熱(re)熔(rong)性的有(you)機硅(gui)樹脂層(ceng)和膠(jiao)牯劑熔(rong)化(hua)(hua)(hua)，此(ci)時(shi)(shi)受(shou)熱(re)熔(rong)化(hua)(hua)(hua)的有(you)機硅(gui)樹脂粘(zhan)(zhan)性變小(xiao)，而特種(zhong)熱(re)敏(min)膠(jiao)粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)化(hua)(hua)(hua)后粘(zhan)(zhan)性增(zeng)加(jia)，使得鋁(lv)層(ceng)與電化(hua)(hua)(hua)鋁(lv)基膜剝離的同時(shi)(shi)轉印(yin)到了承(cheng)印(yin)物(wu)上(shang)(shang)。隨著壓力的卸除，膠(jiao)粘(zhan)(zhan)劑迅速冷卻固化(hua)(hua)(hua)，鋁(lv)層(ceng)牢固地附(fu)著在承(cheng)印(yin)物(wu)上(shang)(shang)，完成(cheng)一個燙(tang)印(yin)過程。