燙金基(ji)本工藝是在壓(ya)(ya)力(li)狀(zhuang)態，即(ji)電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)被燙印(yin)版(ban)、承(cheng)印(yin)物壓(ya)(ya)住的(de)狀(zhuang)態下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)受(shou)(shou)熱(re)使(shi)其上(shang)熱(re)熔性的(de)有機硅樹脂(zhi)(zhi)層和膠(jiao)牯劑熔化(hua)(hua)(hua)，此時(shi)(shi)受(shou)(shou)熱(re)熔化(hua)(hua)(hua)的(de)有機硅樹脂(zhi)(zhi)粘(zhan)(zhan)性變小，而(er)特(te)種熱(re)敏膠(jiao)粘(zhan)(zhan)劑受(shou)(shou)熱(re)熔化(hua)(hua)(hua)后粘(zhan)(zhan)性增加(jia)，使(shi)得鋁(lv)(lv)(lv)層與電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)基(ji)膜剝離的(de)同時(shi)(shi)轉印(yin)到了承(cheng)印(yin)物上(shang)。隨著(zhu)壓(ya)(ya)力(li)的(de)卸除，膠(jiao)粘(zhan)(zhan)劑迅(xun)速冷卻(que)固(gu)化(hua)(hua)(hua)，鋁(lv)(lv)(lv)層牢固(gu)地附著(zhu)在承(cheng)印(yin)物上(shang)，完成一(yi)個燙印(yin)過程。