燙金基(ji)本工藝是(shi)在壓(ya)(ya)力(li)狀態，即電(dian)化(hua)鋁被燙印(yin)版、承(cheng)(cheng)印(yin)物(wu)壓(ya)(ya)住的(de)狀態下，電(dian)化(hua)鋁受(shou)熱使(shi)其上(shang)(shang)熱熔(rong)(rong)性(xing)的(de)有(you)機(ji)硅(gui)樹(shu)脂(zhi)層和膠牯劑(ji)熔(rong)(rong)化(hua)，此時受(shou)熱熔(rong)(rong)化(hua)的(de)有(you)機(ji)硅(gui)樹(shu)脂(zhi)粘(zhan)性(xing)變小(xiao)，而特種熱敏(min)膠粘(zhan)劑(ji)受(shou)熱熔(rong)(rong)化(hua)后粘(zhan)性(xing)增加，使(shi)得鋁層與電(dian)化(hua)鋁基(ji)膜剝離的(de)同時轉(zhuan)印(yin)到了承(cheng)(cheng)印(yin)物(wu)上(shang)(shang)。隨著(zhu)壓(ya)(ya)力(li)的(de)卸除，膠粘(zhan)劑(ji)迅速(su)冷卻固(gu)化(hua)，鋁層牢固(gu)地附著(zhu)在承(cheng)(cheng)印(yin)物(wu)上(shang)(shang)，完成一個燙印(yin)過(guo)程。