燙(tang)金基(ji)(ji)本工(gong)藝是在(zai)壓力狀態，即電(dian)(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)(yin)版(ban)、承(cheng)印(yin)(yin)物壓住的狀態下，電(dian)(dian)化(hua)(hua)鋁(lv)受熱(re)使(shi)其(qi)上(shang)(shang)熱(re)熔(rong)性的有機硅樹脂層和膠牯劑熔(rong)化(hua)(hua)，此時(shi)受熱(re)熔(rong)化(hua)(hua)的有機硅樹脂粘(zhan)性變小(xiao)，而特種熱(re)敏膠粘(zhan)劑受熱(re)熔(rong)化(hua)(hua)后(hou)粘(zhan)性增加(jia)，使(shi)得鋁(lv)層與電(dian)(dian)化(hua)(hua)鋁(lv)基(ji)(ji)膜剝離的同時(shi)轉印(yin)(yin)到(dao)了承(cheng)印(yin)(yin)物上(shang)(shang)。隨著(zhu)壓力的卸除，膠粘(zhan)劑迅速冷(leng)卻(que)固(gu)化(hua)(hua)，鋁(lv)層牢固(gu)地附(fu)著(zhu)在(zai)承(cheng)印(yin)(yin)物上(shang)(shang)，完成一個燙(tang)印(yin)(yin)過程。