燙(tang)金基本工藝是在壓力狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)版、承(cheng)印(yin)物(wu)(wu)壓住的狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)受熱使其上(shang)熱熔(rong)(rong)性(xing)的有機硅(gui)樹脂(zhi)層和(he)膠(jiao)牯劑(ji)熔(rong)(rong)化(hua)(hua)(hua)，此時(shi)受熱熔(rong)(rong)化(hua)(hua)(hua)的有機硅(gui)樹脂(zhi)粘性(xing)變小，而特(te)種熱敏膠(jiao)粘劑(ji)受熱熔(rong)(rong)化(hua)(hua)(hua)后(hou)粘性(xing)增加，使得鋁(lv)(lv)層與電(dian)化(hua)(hua)(hua)鋁(lv)(lv)基膜剝(bo)離(li)的同時(shi)轉印(yin)到了承(cheng)印(yin)物(wu)(wu)上(shang)。隨著壓力的卸(xie)除，膠(jiao)粘劑(ji)迅速(su)冷卻固化(hua)(hua)(hua)，鋁(lv)(lv)層牢固地(di)附(fu)著在承(cheng)印(yin)物(wu)(wu)上(shang)，完(wan)成(cheng)一個(ge)燙(tang)印(yin)過程。