燙(tang)金(jin)基本工藝是在(zai)壓力狀(zhuang)態，即電(dian)化(hua)(hua)鋁被(bei)燙(tang)印(yin)版(ban)、承印(yin)物(wu)(wu)(wu)壓住的狀(zhuang)態下(xia)，電(dian)化(hua)(hua)鋁受熱(re)(re)使其(qi)上熱(re)(re)熔(rong)性(xing)的有機(ji)硅樹脂(zhi)層(ceng)(ceng)和(he)膠牯劑熔(rong)化(hua)(hua)，此時受熱(re)(re)熔(rong)化(hua)(hua)的有機(ji)硅樹脂(zhi)粘性(xing)變小，而特種(zhong)熱(re)(re)敏(min)膠粘劑受熱(re)(re)熔(rong)化(hua)(hua)后粘性(xing)增加，使得鋁層(ceng)(ceng)與電(dian)化(hua)(hua)鋁基膜(mo)剝離的同時轉(zhuan)印(yin)到了承印(yin)物(wu)(wu)(wu)上。隨著壓力的卸(xie)除(chu)，膠粘劑迅速冷卻固(gu)化(hua)(hua)，鋁層(ceng)(ceng)牢固(gu)地附著在(zai)承印(yin)物(wu)(wu)(wu)上，完成一(yi)個燙(tang)印(yin)過程。