燙金基本工藝(yi)是(shi)在壓力狀(zhuang)態，即電(dian)化(hua)(hua)鋁被燙印(yin)(yin)版、承(cheng)(cheng)印(yin)(yin)物(wu)壓住的(de)狀(zhuang)態下，電(dian)化(hua)(hua)鋁受熱使其上熱熔(rong)性(xing)的(de)有機(ji)硅樹脂(zhi)層(ceng)和膠(jiao)牯劑熔(rong)化(hua)(hua)，此時受熱熔(rong)化(hua)(hua)的(de)有機(ji)硅樹脂(zhi)粘(zhan)(zhan)性(xing)變小，而特種熱敏(min)膠(jiao)粘(zhan)(zhan)劑受熱熔(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)增加，使得鋁層(ceng)與電(dian)化(hua)(hua)鋁基膜剝離的(de)同時轉印(yin)(yin)到了承(cheng)(cheng)印(yin)(yin)物(wu)上。隨著壓力的(de)卸(xie)除，膠(jiao)粘(zhan)(zhan)劑迅速冷卻固化(hua)(hua)，鋁層(ceng)牢(lao)固地附著在承(cheng)(cheng)印(yin)(yin)物(wu)上，完(wan)成(cheng)一個燙印(yin)(yin)過程(cheng)。