燙金基(ji)本工(gong)藝(yi)是(shi)在壓力狀(zhuang)態(tai)，即電化(hua)鋁被燙印版、承(cheng)印物壓住的狀(zhuang)態(tai)下(xia)，電化(hua)鋁受(shou)熱(re)使其上(shang)熱(re)熔(rong)(rong)(rong)(rong)性的有(you)機(ji)硅樹脂層和膠牯劑熔(rong)(rong)(rong)(rong)化(hua)，此時(shi)受(shou)熱(re)熔(rong)(rong)(rong)(rong)化(hua)的有(you)機(ji)硅樹脂粘(zhan)(zhan)(zhan)(zhan)性變小，而特種熱(re)敏膠粘(zhan)(zhan)(zhan)(zhan)劑受(shou)熱(re)熔(rong)(rong)(rong)(rong)化(hua)后粘(zhan)(zhan)(zhan)(zhan)性增加，使得鋁層與電化(hua)鋁基(ji)膜(mo)剝離的同時(shi)轉印到了(le)承(cheng)印物上(shang)。隨(sui)著壓力的卸除(chu)，膠粘(zhan)(zhan)(zhan)(zhan)劑迅速冷卻固化(hua)，鋁層牢固地(di)附著在承(cheng)印物上(shang)，完(wan)成一個燙印過程。