燙金基(ji)本工藝是(shi)在壓力(li)狀(zhuang)態(tai)，即電(dian)化(hua)(hua)鋁(lv)被燙印(yin)版、承印(yin)物壓住的(de)狀(zhuang)態(tai)下，電(dian)化(hua)(hua)鋁(lv)受熱(re)使其上熱(re)熔(rong)(rong)性的(de)有機硅樹脂層(ceng)和膠(jiao)牯劑熔(rong)(rong)化(hua)(hua)，此(ci)時受熱(re)熔(rong)(rong)化(hua)(hua)的(de)有機硅樹脂粘(zhan)性變小，而特(te)種熱(re)敏(min)膠(jiao)粘(zhan)劑受熱(re)熔(rong)(rong)化(hua)(hua)后(hou)粘(zhan)性增加，使得(de)鋁(lv)層(ceng)與(yu)電(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離的(de)同(tong)時轉(zhuan)印(yin)到了(le)承印(yin)物上。隨著壓力(li)的(de)卸(xie)除，膠(jiao)粘(zhan)劑迅速冷卻固化(hua)(hua)，鋁(lv)層(ceng)牢固地附著在承印(yin)物上，完(wan)成一個燙印(yin)過程(cheng)。