燙金基本工藝是在壓力(li)狀態，即(ji)電(dian)(dian)化(hua)(hua)鋁被燙印(yin)版、承印(yin)物壓住(zhu)的狀態下，電(dian)(dian)化(hua)(hua)鋁受(shou)熱(re)(re)使(shi)其上(shang)(shang)熱(re)(re)熔(rong)性(xing)的有(you)機硅(gui)樹脂層(ceng)和膠牯劑熔(rong)化(hua)(hua)，此時受(shou)熱(re)(re)熔(rong)化(hua)(hua)的有(you)機硅(gui)樹脂粘性(xing)變小，而特種熱(re)(re)敏(min)膠粘劑受(shou)熱(re)(re)熔(rong)化(hua)(hua)后(hou)粘性(xing)增加(jia)，使(shi)得鋁層(ceng)與電(dian)(dian)化(hua)(hua)鋁基膜剝離(li)的同(tong)時轉印(yin)到了承印(yin)物上(shang)(shang)。隨(sui)著(zhu)壓力(li)的卸(xie)除，膠粘劑迅(xun)速(su)冷卻固化(hua)(hua)，鋁層(ceng)牢固地附著(zhu)在承印(yin)物上(shang)(shang)，完成一個燙印(yin)過程。