燙(tang)金基本工藝是在(zai)壓(ya)力(li)狀(zhuang)態，即電(dian)化(hua)(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)(yin)版、承印(yin)(yin)物(wu)壓(ya)住的狀(zhuang)態下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)受(shou)(shou)熱(re)使其上熱(re)熔(rong)性(xing)的有機(ji)硅(gui)樹脂(zhi)層(ceng)和膠牯劑熔(rong)化(hua)(hua)(hua)，此(ci)時受(shou)(shou)熱(re)熔(rong)化(hua)(hua)(hua)的有機(ji)硅(gui)樹脂(zhi)粘(zhan)性(xing)變小，而(er)特種熱(re)敏膠粘(zhan)劑受(shou)(shou)熱(re)熔(rong)化(hua)(hua)(hua)后(hou)粘(zhan)性(xing)增加，使得鋁(lv)(lv)層(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)(lv)基膜剝(bo)離的同時轉印(yin)(yin)到了(le)承印(yin)(yin)物(wu)上。隨著壓(ya)力(li)的卸(xie)除，膠粘(zhan)劑迅速冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)(lv)層(ceng)牢固(gu)地附著在(zai)承印(yin)(yin)物(wu)上，完成一個燙(tang)印(yin)(yin)過(guo)程(cheng)。