燙金(jin)基(ji)本工藝是在壓力狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)被燙印(yin)版(ban)、承(cheng)(cheng)印(yin)物(wu)壓住(zhu)的(de)狀態(tai)下，電(dian)化(hua)(hua)鋁(lv)受熱(re)(re)使其上熱(re)(re)熔(rong)(rong)性(xing)(xing)的(de)有(you)機硅(gui)樹(shu)脂層(ceng)和膠(jiao)牯劑熔(rong)(rong)化(hua)(hua)，此(ci)時受熱(re)(re)熔(rong)(rong)化(hua)(hua)的(de)有(you)機硅(gui)樹(shu)脂粘(zhan)性(xing)(xing)變小(xiao)，而(er)特種熱(re)(re)敏膠(jiao)粘(zhan)劑受熱(re)(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)性(xing)(xing)增加，使得鋁(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離的(de)同時轉(zhuan)印(yin)到了承(cheng)(cheng)印(yin)物(wu)上。隨著(zhu)壓力的(de)卸除，膠(jiao)粘(zhan)劑迅速冷(leng)卻固化(hua)(hua)，鋁(lv)層(ceng)牢(lao)固地附著(zhu)在承(cheng)(cheng)印(yin)物(wu)上，完成一個燙印(yin)過程(cheng)。