燙(tang)金基本工藝是在壓力狀態(tai)，即電化(hua)(hua)鋁(lv)被(bei)燙(tang)印(yin)版(ban)、承(cheng)印(yin)物壓住的狀態(tai)下，電化(hua)(hua)鋁(lv)受(shou)熱(re)使其上(shang)熱(re)熔(rong)(rong)性(xing)的有機硅樹(shu)脂層和膠(jiao)牯劑熔(rong)(rong)化(hua)(hua)，此時(shi)受(shou)熱(re)熔(rong)(rong)化(hua)(hua)的有機硅樹(shu)脂粘(zhan)(zhan)性(xing)變小，而特種熱(re)敏(min)膠(jiao)粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)增(zeng)加(jia)，使得鋁(lv)層與電化(hua)(hua)鋁(lv)基膜剝(bo)離的同時(shi)轉印(yin)到了承(cheng)印(yin)物上(shang)。隨著(zhu)壓力的卸除，膠(jiao)粘(zhan)(zhan)劑迅速冷卻固化(hua)(hua)，鋁(lv)層牢固地附著(zhu)在承(cheng)印(yin)物上(shang)，完成(cheng)一個燙(tang)印(yin)過程。