燙(tang)金基本工藝(yi)是在壓力(li)狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)被燙(tang)印(yin)(yin)版、承印(yin)(yin)物壓住的狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)受(shou)熱(re)使其上熱(re)熔(rong)性(xing)的有(you)機硅樹脂(zhi)層和膠(jiao)牯劑熔(rong)化(hua)(hua)(hua)，此時受(shou)熱(re)熔(rong)化(hua)(hua)(hua)的有(you)機硅樹脂(zhi)粘(zhan)(zhan)性(xing)變小，而特(te)種熱(re)敏膠(jiao)粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)化(hua)(hua)(hua)后粘(zhan)(zhan)性(xing)增加，使得鋁(lv)(lv)(lv)層與(yu)電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)基膜(mo)剝離(li)的同時轉印(yin)(yin)到了承印(yin)(yin)物上。隨著壓力(li)的卸除(chu)，膠(jiao)粘(zhan)(zhan)劑迅(xun)速(su)冷卻固化(hua)(hua)(hua)，鋁(lv)(lv)(lv)層牢固地附著在承印(yin)(yin)物上，完成一個燙(tang)印(yin)(yin)過程。