燙金基本(ben)工藝是在(zai)(zai)壓力狀態(tai)，即電(dian)(dian)化(hua)(hua)鋁(lv)(lv)被(bei)燙印(yin)版、承印(yin)物壓住的(de)狀態(tai)下，電(dian)(dian)化(hua)(hua)鋁(lv)(lv)受(shou)熱使其(qi)上(shang)熱熔(rong)性(xing)的(de)有(you)(you)機硅樹脂層(ceng)和膠牯劑熔(rong)化(hua)(hua)，此時(shi)受(shou)熱熔(rong)化(hua)(hua)的(de)有(you)(you)機硅樹脂粘(zhan)性(xing)變小，而特種(zhong)熱敏膠粘(zhan)劑受(shou)熱熔(rong)化(hua)(hua)后(hou)粘(zhan)性(xing)增加，使得鋁(lv)(lv)層(ceng)與電(dian)(dian)化(hua)(hua)鋁(lv)(lv)基膜剝(bo)離的(de)同時(shi)轉印(yin)到了承印(yin)物上(shang)。隨著壓力的(de)卸除，膠粘(zhan)劑迅速(su)冷(leng)卻固化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固地(di)附著在(zai)(zai)承印(yin)物上(shang)，完成一個燙印(yin)過程。