燙(tang)金(jin)基(ji)本工藝(yi)是(shi)在壓(ya)力狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)被燙(tang)印(yin)版、承(cheng)(cheng)印(yin)物壓(ya)住的(de)狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)受(shou)熱(re)使其(qi)上熱(re)熔(rong)性的(de)有(you)機硅樹(shu)脂(zhi)層(ceng)(ceng)和膠(jiao)牯劑熔(rong)化(hua)(hua)(hua)，此時受(shou)熱(re)熔(rong)化(hua)(hua)(hua)的(de)有(you)機硅樹(shu)脂(zhi)粘(zhan)性變(bian)小，而特種熱(re)敏(min)膠(jiao)粘(zhan)劑受(shou)熱(re)熔(rong)化(hua)(hua)(hua)后粘(zhan)性增加(jia)，使得鋁(lv)層(ceng)(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)基(ji)膜剝離的(de)同時轉印(yin)到了承(cheng)(cheng)印(yin)物上。隨(sui)著壓(ya)力的(de)卸除，膠(jiao)粘(zhan)劑迅(xun)速冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)層(ceng)(ceng)牢(lao)固(gu)地附著在承(cheng)(cheng)印(yin)物上，完成一(yi)個燙(tang)印(yin)過程。