燙金基本工藝是(shi)在(zai)壓(ya)力狀(zhuang)態，即電(dian)化鋁(lv)(lv)被燙印(yin)版、承(cheng)印(yin)物壓(ya)住的(de)狀(zhuang)態下，電(dian)化鋁(lv)(lv)受(shou)熱(re)使(shi)(shi)其(qi)上熱(re)熔(rong)(rong)性(xing)(xing)的(de)有機硅(gui)樹脂(zhi)層和膠牯劑熔(rong)(rong)化，此時(shi)(shi)受(shou)熱(re)熔(rong)(rong)化的(de)有機硅(gui)樹脂(zhi)粘(zhan)(zhan)性(xing)(xing)變小(xiao)，而(er)特種熱(re)敏膠粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)(rong)化后粘(zhan)(zhan)性(xing)(xing)增(zeng)加，使(shi)(shi)得(de)鋁(lv)(lv)層與電(dian)化鋁(lv)(lv)基膜剝離的(de)同(tong)時(shi)(shi)轉印(yin)到了承(cheng)印(yin)物上。隨著壓(ya)力的(de)卸除，膠粘(zhan)(zhan)劑迅速冷卻固(gu)化，鋁(lv)(lv)層牢(lao)固(gu)地附著在(zai)承(cheng)印(yin)物上，完成一個燙印(yin)過(guo)程。