燙金基(ji)本工藝是(shi)在(zai)壓力狀(zhuang)態，即電(dian)化(hua)(hua)(hua)鋁(lv)被(bei)燙印(yin)版、承(cheng)印(yin)物壓住的狀(zhuang)態下，電(dian)化(hua)(hua)(hua)鋁(lv)受熱(re)使其上(shang)熱(re)熔(rong)性的有機(ji)硅(gui)樹脂層和(he)膠(jiao)牯劑(ji)熔(rong)化(hua)(hua)(hua)，此時(shi)(shi)受熱(re)熔(rong)化(hua)(hua)(hua)的有機(ji)硅(gui)樹脂粘(zhan)(zhan)性變小，而(er)特種熱(re)敏膠(jiao)粘(zhan)(zhan)劑(ji)受熱(re)熔(rong)化(hua)(hua)(hua)后(hou)粘(zhan)(zhan)性增加，使得鋁(lv)層與電(dian)化(hua)(hua)(hua)鋁(lv)基(ji)膜(mo)剝離(li)的同時(shi)(shi)轉印(yin)到了承(cheng)印(yin)物上(shang)。隨(sui)著壓力的卸(xie)除，膠(jiao)粘(zhan)(zhan)劑(ji)迅速冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)層牢固(gu)地附著在(zai)承(cheng)印(yin)物上(shang)，完(wan)成一個燙印(yin)過程。