燙(tang)金基本工藝是在壓(ya)(ya)力狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)(lv)被(bei)燙(tang)印(yin)(yin)(yin)版、承印(yin)(yin)(yin)物壓(ya)(ya)住(zhu)的(de)狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)受(shou)熱使(shi)其上熱熔(rong)性(xing)的(de)有機硅樹(shu)(shu)脂(zhi)層(ceng)和膠(jiao)牯劑熔(rong)化(hua)(hua)(hua)，此時(shi)受(shou)熱熔(rong)化(hua)(hua)(hua)的(de)有機硅樹(shu)(shu)脂(zhi)粘(zhan)性(xing)變小(xiao)，而(er)特種熱敏膠(jiao)粘(zhan)劑受(shou)熱熔(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)增加(jia)，使(shi)得鋁(lv)(lv)層(ceng)與(yu)電(dian)化(hua)(hua)(hua)鋁(lv)(lv)基膜剝(bo)離的(de)同時(shi)轉(zhuan)印(yin)(yin)(yin)到(dao)了(le)承印(yin)(yin)(yin)物上。隨著壓(ya)(ya)力的(de)卸除，膠(jiao)粘(zhan)劑迅(xun)速冷卻固化(hua)(hua)(hua)，鋁(lv)(lv)層(ceng)牢固地附著在承印(yin)(yin)(yin)物上，完成一個(ge)燙(tang)印(yin)(yin)(yin)過程(cheng)。