燙金(jin)基(ji)本工藝(yi)是在壓(ya)(ya)力狀態(tai)，即電(dian)化(hua)鋁(lv)被燙印(yin)版、承印(yin)物(wu)壓(ya)(ya)住的(de)(de)狀態(tai)下，電(dian)化(hua)鋁(lv)受熱(re)使(shi)其上熱(re)熔(rong)(rong)(rong)性(xing)的(de)(de)有(you)機硅樹脂層(ceng)和膠(jiao)牯劑熔(rong)(rong)(rong)化(hua)，此時受熱(re)熔(rong)(rong)(rong)化(hua)的(de)(de)有(you)機硅樹脂粘(zhan)性(xing)變(bian)小，而特種熱(re)敏膠(jiao)粘(zhan)劑受熱(re)熔(rong)(rong)(rong)化(hua)后粘(zhan)性(xing)增(zeng)加(jia)，使(shi)得鋁(lv)層(ceng)與(yu)電(dian)化(hua)鋁(lv)基(ji)膜剝離的(de)(de)同時轉印(yin)到了(le)承印(yin)物(wu)上。隨著(zhu)壓(ya)(ya)力的(de)(de)卸除，膠(jiao)粘(zhan)劑迅速(su)冷(leng)卻固(gu)化(hua)，鋁(lv)層(ceng)牢固(gu)地附著(zhu)在承印(yin)物(wu)上，完成(cheng)一(yi)個(ge)燙印(yin)過程。