燙(tang)金基(ji)本工藝是在壓力(li)(li)狀態(tai)，即電(dian)化(hua)(hua)(hua)(hua)鋁被燙(tang)印版(ban)、承(cheng)印物壓住的狀態(tai)下(xia)，電(dian)化(hua)(hua)(hua)(hua)鋁受(shou)熱(re)(re)使其上熱(re)(re)熔(rong)(rong)性(xing)的有機硅(gui)(gui)樹脂層(ceng)和膠(jiao)牯(gu)劑熔(rong)(rong)化(hua)(hua)(hua)(hua)，此時(shi)受(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)(hua)(hua)的有機硅(gui)(gui)樹脂粘(zhan)(zhan)性(xing)變(bian)小，而特種熱(re)(re)敏膠(jiao)粘(zhan)(zhan)劑受(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)(hua)(hua)后粘(zhan)(zhan)性(xing)增(zeng)加，使得鋁層(ceng)與(yu)電(dian)化(hua)(hua)(hua)(hua)鋁基(ji)膜剝離的同時(shi)轉印到了承(cheng)印物上。隨著壓力(li)(li)的卸除，膠(jiao)粘(zhan)(zhan)劑迅速冷卻(que)固化(hua)(hua)(hua)(hua)，鋁層(ceng)牢固地附著在承(cheng)印物上，完(wan)成一個燙(tang)印過程。