燙(tang)金基(ji)本工藝是在(zai)壓力狀(zhuang)態，即電化(hua)(hua)鋁(lv)被燙(tang)印(yin)版(ban)、承(cheng)(cheng)印(yin)物壓住的狀(zhuang)態下(xia)，電化(hua)(hua)鋁(lv)受(shou)熱(re)使其上(shang)熱(re)熔(rong)(rong)(rong)性的有機(ji)(ji)硅樹脂層和(he)膠牯(gu)劑熔(rong)(rong)(rong)化(hua)(hua)，此(ci)時受(shou)熱(re)熔(rong)(rong)(rong)化(hua)(hua)的有機(ji)(ji)硅樹脂粘性變小(xiao)，而特種熱(re)敏膠粘劑受(shou)熱(re)熔(rong)(rong)(rong)化(hua)(hua)后粘性增加，使得(de)鋁(lv)層與(yu)電化(hua)(hua)鋁(lv)基(ji)膜(mo)剝離(li)的同時轉印(yin)到了承(cheng)(cheng)印(yin)物上(shang)。隨著壓力的卸除，膠粘劑迅速冷卻固化(hua)(hua)，鋁(lv)層牢(lao)固地附(fu)著在(zai)承(cheng)(cheng)印(yin)物上(shang)，完(wan)成(cheng)一個燙(tang)印(yin)過程(cheng)。