燙(tang)金基本工藝是在壓力(li)狀態，即(ji)電(dian)化(hua)(hua)鋁(lv)(lv)(lv)被燙(tang)印(yin)版、承(cheng)(cheng)印(yin)物(wu)壓住的(de)狀態下，電(dian)化(hua)(hua)鋁(lv)(lv)(lv)受(shou)熱(re)(re)使其上(shang)熱(re)(re)熔(rong)(rong)性(xing)的(de)有機硅樹(shu)脂(zhi)層和膠牯劑熔(rong)(rong)化(hua)(hua)，此時受(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)的(de)有機硅樹(shu)脂(zhi)粘(zhan)性(xing)變小，而特種熱(re)(re)敏膠粘(zhan)劑受(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)后(hou)粘(zhan)性(xing)增加，使得鋁(lv)(lv)(lv)層與電(dian)化(hua)(hua)鋁(lv)(lv)(lv)基膜剝離的(de)同(tong)時轉(zhuan)印(yin)到(dao)了承(cheng)(cheng)印(yin)物(wu)上(shang)。隨(sui)著(zhu)壓力(li)的(de)卸除，膠粘(zhan)劑迅速(su)冷(leng)卻固化(hua)(hua)，鋁(lv)(lv)(lv)層牢(lao)固地附著(zhu)在承(cheng)(cheng)印(yin)物(wu)上(shang)，完成一個燙(tang)印(yin)過程。