燙(tang)(tang)金(jin)基本工藝是在壓力狀態(tai)，即電(dian)化(hua)鋁(lv)(lv)被燙(tang)(tang)印版、承印物(wu)壓住的(de)(de)狀態(tai)下，電(dian)化(hua)鋁(lv)(lv)受(shou)熱(re)使其上(shang)熱(re)熔(rong)(rong)性的(de)(de)有機硅(gui)(gui)樹脂(zhi)層(ceng)(ceng)和膠牯劑熔(rong)(rong)化(hua)，此(ci)時受(shou)熱(re)熔(rong)(rong)化(hua)的(de)(de)有機硅(gui)(gui)樹脂(zhi)粘性變(bian)小，而(er)特種(zhong)熱(re)敏膠粘劑受(shou)熱(re)熔(rong)(rong)化(hua)后粘性增(zeng)加，使得鋁(lv)(lv)層(ceng)(ceng)與電(dian)化(hua)鋁(lv)(lv)基膜剝(bo)離的(de)(de)同(tong)時轉印到了承印物(wu)上(shang)。隨著壓力的(de)(de)卸除，膠粘劑迅速冷卻固化(hua)，鋁(lv)(lv)層(ceng)(ceng)牢固地附著在承印物(wu)上(shang)，完成一個燙(tang)(tang)印過程。