燙金基(ji)本工藝是在(zai)(zai)壓(ya)(ya)力(li)狀態(tai)，即電(dian)(dian)化鋁(lv)(lv)被燙印(yin)版、承(cheng)印(yin)物壓(ya)(ya)住的(de)(de)狀態(tai)下，電(dian)(dian)化鋁(lv)(lv)受(shou)熱(re)(re)使其上熱(re)(re)熔(rong)性(xing)(xing)的(de)(de)有機硅樹脂(zhi)層和膠牯劑熔(rong)化，此時(shi)受(shou)熱(re)(re)熔(rong)化的(de)(de)有機硅樹脂(zhi)粘(zhan)(zhan)性(xing)(xing)變小，而特種熱(re)(re)敏膠粘(zhan)(zhan)劑受(shou)熱(re)(re)熔(rong)化后粘(zhan)(zhan)性(xing)(xing)增(zeng)加，使得(de)鋁(lv)(lv)層與電(dian)(dian)化鋁(lv)(lv)基(ji)膜剝(bo)離的(de)(de)同時(shi)轉(zhuan)印(yin)到了承(cheng)印(yin)物上。隨著(zhu)壓(ya)(ya)力(li)的(de)(de)卸除(chu)，膠粘(zhan)(zhan)劑迅速冷卻(que)固(gu)化，鋁(lv)(lv)層牢固(gu)地附著(zhu)在(zai)(zai)承(cheng)印(yin)物上，完成一個燙印(yin)過程。