燙金基本工藝是(shi)在(zai)壓力(li)狀態，即電(dian)化(hua)(hua)鋁(lv)(lv)被燙印版、承印物(wu)壓住(zhu)的(de)狀態下(xia)，電(dian)化(hua)(hua)鋁(lv)(lv)受(shou)熱(re)(re)使其上熱(re)(re)熔(rong)(rong)性(xing)的(de)有機硅樹脂層和膠牯劑(ji)熔(rong)(rong)化(hua)(hua)，此時(shi)受(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)的(de)有機硅樹脂粘性(xing)變(bian)小(xiao)，而(er)特種(zhong)熱(re)(re)敏(min)膠粘劑(ji)受(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)后粘性(xing)增加(jia)，使得鋁(lv)(lv)層與電(dian)化(hua)(hua)鋁(lv)(lv)基膜(mo)剝離的(de)同時(shi)轉印到了承印物(wu)上。隨著壓力(li)的(de)卸(xie)除，膠粘劑(ji)迅速冷卻固(gu)化(hua)(hua)，鋁(lv)(lv)層牢固(gu)地附著在(zai)承印物(wu)上，完成一個燙印過(guo)程。