燙金(jin)基(ji)(ji)本工藝是在壓力(li)狀(zhuang)態，即電化(hua)(hua)(hua)鋁(lv)(lv)(lv)被燙印版、承印物(wu)壓住的狀(zhuang)態下，電化(hua)(hua)(hua)鋁(lv)(lv)(lv)受(shou)(shou)熱使其上熱熔(rong)(rong)性(xing)的有機(ji)硅樹脂層和膠牯劑熔(rong)(rong)化(hua)(hua)(hua)，此時受(shou)(shou)熱熔(rong)(rong)化(hua)(hua)(hua)的有機(ji)硅樹脂粘(zhan)性(xing)變小(xiao)，而(er)特種熱敏膠粘(zhan)劑受(shou)(shou)熱熔(rong)(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)(lv)(lv)層與(yu)電化(hua)(hua)(hua)鋁(lv)(lv)(lv)基(ji)(ji)膜剝離(li)的同時轉印到了承印物(wu)上。隨著壓力(li)的卸(xie)除，膠粘(zhan)劑迅速冷卻(que)固化(hua)(hua)(hua)，鋁(lv)(lv)(lv)層牢固地附著在承印物(wu)上，完成(cheng)一個(ge)燙印過程。