燙(tang)金(jin)基本工藝是在(zai)壓力狀(zhuang)態(tai)，即(ji)電(dian)化(hua)(hua)(hua)鋁(lv)(lv)被燙(tang)印版、承(cheng)印物(wu)壓住(zhu)的(de)狀(zhuang)態(tai)下(xia)，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)受熱(re)使(shi)其上熱(re)熔(rong)(rong)(rong)性(xing)的(de)有機硅(gui)樹(shu)脂(zhi)層(ceng)(ceng)和膠牯(gu)劑熔(rong)(rong)(rong)化(hua)(hua)(hua)，此時(shi)受熱(re)熔(rong)(rong)(rong)化(hua)(hua)(hua)的(de)有機硅(gui)樹(shu)脂(zhi)粘性(xing)變(bian)小(xiao)，而特種熱(re)敏膠粘劑受熱(re)熔(rong)(rong)(rong)化(hua)(hua)(hua)后(hou)粘性(xing)增加(jia)，使(shi)得鋁(lv)(lv)層(ceng)(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)(lv)基膜剝(bo)離(li)的(de)同時(shi)轉(zhuan)印到(dao)了承(cheng)印物(wu)上。隨(sui)著(zhu)壓力的(de)卸除，膠粘劑迅速冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)(lv)層(ceng)(ceng)牢固(gu)地附著(zhu)在(zai)承(cheng)印物(wu)上，完成一個(ge)燙(tang)印過程。