燙(tang)金基本工藝是在壓力狀態(tai)，即電(dian)(dian)化(hua)(hua)鋁(lv)(lv)被(bei)燙(tang)印(yin)版、承(cheng)印(yin)物(wu)壓住的狀態(tai)下，電(dian)(dian)化(hua)(hua)鋁(lv)(lv)受熱(re)(re)使(shi)其上(shang)熱(re)(re)熔(rong)性(xing)的有(you)機硅樹(shu)脂(zhi)(zhi)層和膠牯(gu)劑(ji)(ji)熔(rong)化(hua)(hua)，此(ci)時受熱(re)(re)熔(rong)化(hua)(hua)的有(you)機硅樹(shu)脂(zhi)(zhi)粘性(xing)變小，而特種(zhong)熱(re)(re)敏膠粘劑(ji)(ji)受熱(re)(re)熔(rong)化(hua)(hua)后粘性(xing)增加，使(shi)得鋁(lv)(lv)層與電(dian)(dian)化(hua)(hua)鋁(lv)(lv)基膜剝離的同時轉印(yin)到了(le)承(cheng)印(yin)物(wu)上(shang)。隨著(zhu)壓力的卸除，膠粘劑(ji)(ji)迅速(su)冷卻(que)固化(hua)(hua)，鋁(lv)(lv)層牢固地附著(zhu)在承(cheng)印(yin)物(wu)上(shang)，完成一個(ge)燙(tang)印(yin)過(guo)程。