燙金基(ji)本工藝是在壓力狀態，即電(dian)(dian)(dian)化(hua)(hua)鋁(lv)(lv)被燙印(yin)版(ban)、承印(yin)物(wu)壓住的(de)狀態下，電(dian)(dian)(dian)化(hua)(hua)鋁(lv)(lv)受熱(re)使其上熱(re)熔性的(de)有機硅樹脂(zhi)層(ceng)(ceng)(ceng)和膠牯劑(ji)熔化(hua)(hua)，此時受熱(re)熔化(hua)(hua)的(de)有機硅樹脂(zhi)粘性變小，而特種(zhong)熱(re)敏膠粘劑(ji)受熱(re)熔化(hua)(hua)后粘性增加，使得(de)鋁(lv)(lv)層(ceng)(ceng)(ceng)與電(dian)(dian)(dian)化(hua)(hua)鋁(lv)(lv)基(ji)膜(mo)剝離的(de)同時轉印(yin)到了(le)承印(yin)物(wu)上。隨著壓力的(de)卸(xie)除(chu)，膠粘劑(ji)迅(xun)速冷卻固(gu)(gu)化(hua)(hua)，鋁(lv)(lv)層(ceng)(ceng)(ceng)牢固(gu)(gu)地附著在承印(yin)物(wu)上，完(wan)成一個燙印(yin)過程。