燙金基(ji)本工藝是在(zai)壓力狀態，即(ji)電化(hua)(hua)(hua)鋁被燙印版、承(cheng)印物(wu)壓住的狀態下，電化(hua)(hua)(hua)鋁受(shou)熱使其上(shang)熱熔(rong)(rong)(rong)性(xing)的有機(ji)硅(gui)(gui)樹脂層和膠(jiao)牯劑熔(rong)(rong)(rong)化(hua)(hua)(hua)，此時(shi)受(shou)熱熔(rong)(rong)(rong)化(hua)(hua)(hua)的有機(ji)硅(gui)(gui)樹脂粘(zhan)性(xing)變小，而(er)特種熱敏膠(jiao)粘(zhan)劑受(shou)熱熔(rong)(rong)(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)增加，使得(de)鋁層與電化(hua)(hua)(hua)鋁基(ji)膜(mo)剝(bo)離的同時(shi)轉印到了承(cheng)印物(wu)上(shang)。隨著壓力的卸除，膠(jiao)粘(zhan)劑迅(xun)速冷卻固化(hua)(hua)(hua)，鋁層牢固地附著在(zai)承(cheng)印物(wu)上(shang)，完成一個燙印過(guo)程(cheng)。