燙(tang)(tang)金基本工藝是在壓力狀態(tai)，即電(dian)(dian)化(hua)鋁被燙(tang)(tang)印版、承印物壓住的狀態(tai)下，電(dian)(dian)化(hua)鋁受(shou)熱(re)使(shi)其(qi)上(shang)熱(re)熔(rong)性(xing)的有(you)機硅(gui)樹脂層(ceng)和(he)膠牯(gu)劑(ji)(ji)熔(rong)化(hua)，此時受(shou)熱(re)熔(rong)化(hua)的有(you)機硅(gui)樹脂粘(zhan)(zhan)性(xing)變小，而特(te)種熱(re)敏膠粘(zhan)(zhan)劑(ji)(ji)受(shou)熱(re)熔(rong)化(hua)后粘(zhan)(zhan)性(xing)增加，使(shi)得(de)鋁層(ceng)與電(dian)(dian)化(hua)鋁基膜剝(bo)離(li)的同(tong)時轉(zhuan)印到了承印物上(shang)。隨著壓力的卸(xie)除(chu)，膠粘(zhan)(zhan)劑(ji)(ji)迅速冷卻固化(hua)，鋁層(ceng)牢固地附著在承印物上(shang)，完成一個燙(tang)(tang)印過(guo)程。