燙(tang)(tang)金基(ji)本工藝(yi)是在壓力(li)狀態，即電化(hua)(hua)(hua)鋁(lv)被燙(tang)(tang)印版(ban)、承(cheng)印物(wu)壓住的狀態下(xia)，電化(hua)(hua)(hua)鋁(lv)受熱(re)使其上熱(re)熔(rong)性(xing)(xing)的有機(ji)硅樹脂層和膠牯劑熔(rong)化(hua)(hua)(hua)，此時(shi)受熱(re)熔(rong)化(hua)(hua)(hua)的有機(ji)硅樹脂粘(zhan)(zhan)性(xing)(xing)變(bian)小，而特種熱(re)敏膠粘(zhan)(zhan)劑受熱(re)熔(rong)化(hua)(hua)(hua)后粘(zhan)(zhan)性(xing)(xing)增加，使得(de)鋁(lv)層與電化(hua)(hua)(hua)鋁(lv)基(ji)膜剝離的同(tong)時(shi)轉印到了承(cheng)印物(wu)上。隨著(zhu)壓力(li)的卸除(chu)，膠粘(zhan)(zhan)劑迅速冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)層牢固(gu)地附著(zhu)在承(cheng)印物(wu)上，完成一個燙(tang)(tang)印過程。