燙(tang)金基(ji)本工藝是在(zai)壓(ya)力(li)狀(zhuang)態，即(ji)電化(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)版、承(cheng)印(yin)物(wu)壓(ya)住的狀(zhuang)態下，電化(hua)(hua)鋁(lv)(lv)受熱(re)使(shi)其(qi)上(shang)(shang)熱(re)熔(rong)性(xing)的有(you)機硅樹(shu)脂層(ceng)和膠(jiao)牯(gu)劑(ji)熔(rong)化(hua)(hua)，此時(shi)受熱(re)熔(rong)化(hua)(hua)的有(you)機硅樹(shu)脂粘(zhan)(zhan)性(xing)變小(xiao)，而特種熱(re)敏(min)膠(jiao)粘(zhan)(zhan)劑(ji)受熱(re)熔(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)增加(jia)，使(shi)得鋁(lv)(lv)層(ceng)與電化(hua)(hua)鋁(lv)(lv)基(ji)膜剝離(li)的同(tong)時(shi)轉印(yin)到了承(cheng)印(yin)物(wu)上(shang)(shang)。隨著(zhu)壓(ya)力(li)的卸(xie)除，膠(jiao)粘(zhan)(zhan)劑(ji)迅(xun)速冷(leng)卻固(gu)化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固(gu)地附著(zhu)在(zai)承(cheng)印(yin)物(wu)上(shang)(shang)，完(wan)成一個燙(tang)印(yin)過程(cheng)。