燙金基本工藝是在(zai)壓(ya)力狀態，即電化(hua)(hua)鋁(lv)被燙印版、承(cheng)印物壓(ya)住的狀態下(xia)，電化(hua)(hua)鋁(lv)受(shou)(shou)(shou)熱(re)使(shi)其上(shang)熱(re)熔(rong)性的有(you)機硅樹脂層(ceng)(ceng)和膠(jiao)牯劑(ji)熔(rong)化(hua)(hua)，此(ci)時(shi)受(shou)(shou)(shou)熱(re)熔(rong)化(hua)(hua)的有(you)機硅樹脂粘(zhan)性變小，而(er)特種熱(re)敏(min)膠(jiao)粘(zhan)劑(ji)受(shou)(shou)(shou)熱(re)熔(rong)化(hua)(hua)后粘(zhan)性增加，使(shi)得鋁(lv)層(ceng)(ceng)與電化(hua)(hua)鋁(lv)基膜剝離的同(tong)時(shi)轉印到了承(cheng)印物上(shang)。隨著(zhu)(zhu)壓(ya)力的卸除，膠(jiao)粘(zhan)劑(ji)迅速冷卻固化(hua)(hua)，鋁(lv)層(ceng)(ceng)牢固地附著(zhu)(zhu)在(zai)承(cheng)印物上(shang)，完(wan)成一(yi)個燙印過程(cheng)。