燙(tang)金基本工藝是在壓力狀態，即電化(hua)(hua)鋁(lv)被燙(tang)印版、承(cheng)印物(wu)(wu)壓住的狀態下，電化(hua)(hua)鋁(lv)受(shou)熱(re)(re)(re)使其上(shang)熱(re)(re)(re)熔(rong)(rong)(rong)性的有(you)機硅樹脂層和膠(jiao)牯劑熔(rong)(rong)(rong)化(hua)(hua)，此(ci)時(shi)受(shou)熱(re)(re)(re)熔(rong)(rong)(rong)化(hua)(hua)的有(you)機硅樹脂粘(zhan)性變小，而(er)特種熱(re)(re)(re)敏膠(jiao)粘(zhan)劑受(shou)熱(re)(re)(re)熔(rong)(rong)(rong)化(hua)(hua)后(hou)粘(zhan)性增加，使得鋁(lv)層與(yu)電化(hua)(hua)鋁(lv)基膜剝離的同時(shi)轉印到了承(cheng)印物(wu)(wu)上(shang)。隨著壓力的卸(xie)除，膠(jiao)粘(zhan)劑迅速冷(leng)卻固(gu)化(hua)(hua)，鋁(lv)層牢(lao)固(gu)地附著在承(cheng)印物(wu)(wu)上(shang)，完成一個燙(tang)印過程(cheng)。