燙金基(ji)本(ben)工藝是(shi)在壓力狀態(tai)，即電化(hua)(hua)(hua)(hua)鋁被燙印版、承(cheng)(cheng)印物壓住的狀態(tai)下(xia)，電化(hua)(hua)(hua)(hua)鋁受(shou)熱(re)使(shi)其(qi)上(shang)熱(re)熔(rong)(rong)性(xing)的有機硅樹脂(zhi)層和膠(jiao)牯劑熔(rong)(rong)化(hua)(hua)(hua)(hua)，此時(shi)受(shou)熱(re)熔(rong)(rong)化(hua)(hua)(hua)(hua)的有機硅樹脂(zhi)粘性(xing)變小(xiao)，而特種熱(re)敏膠(jiao)粘劑受(shou)熱(re)熔(rong)(rong)化(hua)(hua)(hua)(hua)后粘性(xing)增加，使(shi)得鋁層與電化(hua)(hua)(hua)(hua)鋁基(ji)膜(mo)剝離的同時(shi)轉印到了承(cheng)(cheng)印物上(shang)。隨(sui)著(zhu)壓力的卸除，膠(jiao)粘劑迅速(su)冷卻固化(hua)(hua)(hua)(hua)，鋁層牢(lao)固地附著(zhu)在承(cheng)(cheng)印物上(shang)，完成一(yi)個(ge)燙印過(guo)程。