燙金基(ji)本工藝是(shi)在壓(ya)(ya)力狀態(tai)，即電(dian)(dian)化(hua)(hua)鋁(lv)(lv)被燙印版、承印物(wu)壓(ya)(ya)住的狀態(tai)下，電(dian)(dian)化(hua)(hua)鋁(lv)(lv)受熱(re)使其上熱(re)熔(rong)(rong)性(xing)的有(you)(you)機(ji)硅樹脂層和膠(jiao)牯劑(ji)熔(rong)(rong)化(hua)(hua)，此(ci)時(shi)受熱(re)熔(rong)(rong)化(hua)(hua)的有(you)(you)機(ji)硅樹脂粘性(xing)變小，而特(te)種熱(re)敏膠(jiao)粘劑(ji)受熱(re)熔(rong)(rong)化(hua)(hua)后粘性(xing)增加，使得鋁(lv)(lv)層與(yu)電(dian)(dian)化(hua)(hua)鋁(lv)(lv)基(ji)膜剝離的同(tong)時(shi)轉(zhuan)印到了承印物(wu)上。隨著壓(ya)(ya)力的卸除(chu)，膠(jiao)粘劑(ji)迅速冷卻固化(hua)(hua)，鋁(lv)(lv)層牢固地附著在承印物(wu)上，完成一個燙印過程。