燙金基(ji)本工藝是(shi)在壓(ya)(ya)力狀態(tai)，即電(dian)(dian)化(hua)(hua)鋁(lv)被燙印版、承印物壓(ya)(ya)住的(de)狀態(tai)下，電(dian)(dian)化(hua)(hua)鋁(lv)受(shou)(shou)(shou)熱使(shi)其上熱熔(rong)(rong)性的(de)有(you)機硅(gui)樹(shu)脂(zhi)層(ceng)和膠(jiao)牯劑熔(rong)(rong)化(hua)(hua)，此時(shi)受(shou)(shou)(shou)熱熔(rong)(rong)化(hua)(hua)的(de)有(you)機硅(gui)樹(shu)脂(zhi)粘(zhan)(zhan)性變小，而特種熱敏膠(jiao)粘(zhan)(zhan)劑受(shou)(shou)(shou)熱熔(rong)(rong)化(hua)(hua)后(hou)粘(zhan)(zhan)性增加，使(shi)得鋁(lv)層(ceng)與電(dian)(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離的(de)同(tong)時(shi)轉印到了承印物上。隨著(zhu)壓(ya)(ya)力的(de)卸除，膠(jiao)粘(zhan)(zhan)劑迅速(su)冷卻固化(hua)(hua)，鋁(lv)層(ceng)牢固地附著(zhu)在承印物上，完成一個燙印過程。