燙金基本工藝(yi)是在壓力(li)狀(zhuang)態(tai)，即電(dian)(dian)化(hua)(hua)鋁(lv)被(bei)燙印(yin)版、承(cheng)(cheng)印(yin)物(wu)壓住的(de)狀(zhuang)態(tai)下，電(dian)(dian)化(hua)(hua)鋁(lv)受熱(re)使其上(shang)熱(re)熔(rong)性的(de)有(you)(you)機硅(gui)樹脂(zhi)層(ceng)和膠牯劑熔(rong)化(hua)(hua)，此時(shi)(shi)受熱(re)熔(rong)化(hua)(hua)的(de)有(you)(you)機硅(gui)樹脂(zhi)粘(zhan)性變小，而特種(zhong)熱(re)敏膠粘(zhan)劑受熱(re)熔(rong)化(hua)(hua)后(hou)粘(zhan)性增加，使得(de)鋁(lv)層(ceng)與(yu)電(dian)(dian)化(hua)(hua)鋁(lv)基膜剝離的(de)同時(shi)(shi)轉(zhuan)印(yin)到了承(cheng)(cheng)印(yin)物(wu)上(shang)。隨著壓力(li)的(de)卸除，膠粘(zhan)劑迅速冷卻固(gu)化(hua)(hua)，鋁(lv)層(ceng)牢固(gu)地附著在承(cheng)(cheng)印(yin)物(wu)上(shang)，完成一(yi)個燙印(yin)過程。